 |
| VSEA7025 | 08/08/2007 | SI Japan Article July 2007 - Advantages of Dual Magnet Ribbon Beam Architecture for Particle Control in Single Wafer High Current ImplantAuthor: C. Campbell.G. Redinbo.J. Blake.P. Kellerman.E. Moore.N. Variam.Y. Katsuragi And N. SakumotoImplanter Types: VIISta HC | |
 |
| VSEA7024 | 07/31/2007 | Solid State Article July 2007 - Precision Requirements for Advanced High Performance Logic ImplantationAuthor: Hans Gossman.Greg Redinbo.Yuri Erokhin.Terry Romig.Kim Elshot.Jiejie Xu And Jennifer MccombImplanter Types: VIISta HC | |
 |
| VSEA7023 | 11/30/2006 | Using Multiple Implant Regions To Reduce Development Wafer UsageAuthor: S. R. Walther.S. Falk.S. Mehta.Y. Erokhin.And P. NunanImplanter Types: All VIISta Models | |
 |
| VSEA7022 | 11/30/2006 | Process Transferability from a Spot Beam to a Ribbon Beam Implanter: CMOS Device MatchingAuthor: Vincent Kaeppelin.Zdenek Chalupa.Laurent Frioulaud.Sandeep Mehta.Baonian Guo.Kyu-Ha Shim.Horst Lendzian And Yuri ErokhinImplanter Types: VIISta 80 | |
 |
| VSEA7021 | 11/30/2006 | Process Control in Production-Worthy Plasma Doping TechnologyAuthor: Edmund J. Winder.Ziwei Fang.Edwin Arevalo.Tim Miller.Harold Persing.Vikram Singh.And T.M. ParrillImplanter Types: P2Lad | |
 |
| VSEA7020 | 11/30/2006 | Plasma Doping For P+ Junction Formation In 90 nm NOR
Flash Memory TechnologyAuthor: Dario Bigarella.Valter Soncini.Deven Raj.Vikram Singh.Steve WaltherImplanter Types: P2Lad | |
 |
| VSEA7019 | 11/30/2006 | Optimized Autotuning for Single Wafer High-Current and Medium-Current ImplantersAuthor: J.T. Scheuer.A. Cucchetti.M. Welsch.W. Callahan.K. Luey.And J.C. OlsonImplanter Types: VIISta 80, VIISta 810 | |
 |
| VSEA7018 | 11/30/2006 | Next Generation Medium Current Product: VIISta 900XPAuthor: A. RenauImplanter Types: VIISta 900XP | |
 |
| VSEA7017 | 11/30/2006 | Metrology Requirements For Single Wafer Ion ImplantersAuthor: Joseph C. Olson.Gordon Angel.Atul Gupta.Rosario Mollica.Daniel Distaso.Jinning LiuImplanter Types: All Models | |
 |
| VSEA7016 | 11/30/2006 | Maximizing Productivity for Well ImplantationAuthor: Qing Zhai.Youn Ki Kim.Dennis Rodier.And Naushad VariamImplanter Types: VIISta 3000, VIISta 810 | |
 |
| VSEA7015 | 11/30/2006 | Indium Performance on the V810Author: Russell J. Low & Qing ZhaiImplanter Types: VIISta 810 | |
 |
| VSEA7014 | 11/30/2006 | Improved Ion Beam Incident Angle Control for Varian E220 and E500 ImplantersAuthor: David Hendrix.Zhiyong Zhao.Reuel Liebert.Ken Gifford And Pierre MitchellImplanter Types: E220/E500 | |
 |
| VSEA7013 | 11/30/2006 | Impact of Dose Rate Effects and Damage Engineering on Device PerformanceAuthor: Kyuha Shim.Yeonsang Hwang.Yongseung Lee.Jungsoo An.Seonho Ryu.Seungho Hahn.Changjune Cho.Namhae Hur.Baonian Guo.Jinning Liu.Yuri.ErokhinImplanter Types: All Models | |
 |
| VSEA7012 | 11/30/2006 | High Current Implant Precision Requirements for Sub-65 nm Logic DevicesAuthor: Yuri Erokhin.Terry Romig.Elshot Kim.Jiejie Xu.Baonian Guo.Jinnig Liu.Kyu-Ha.Shim And Peter NunanImplanter Types: VIISta 80 | |
 |
| VSEA7011 | 11/30/2006 | Enhanced Dosimetry For Single Wafer High-Current ImplantersAuthor: J.T. Scheuer.J. Dzengeleski.D. Distaso.D. Timberlake.J. Cummings.And J.C. OlsonImplanter Types: VIISta 80 | |
 |
| VSEA7010 | 11/30/2006 | Efficient High Current Process Transfer and Device Matching Strategies for sub-90nm ManufacturingAuthor: Dennis Lee.Nyensiong Loh.Miow Chin Tan.Kyuha Shim.Scott Falk.Baonian Guo.Scott Jillson.Bryan Wong.Kherchong Loh.Sandeep Mehta.Yuri ErokhinImplanter Types: VIISta 80 | |
 |
| VSEA7009 | 11/30/2006 | Defect Behavior in BF2 Implants For S/D Applications as a Function of Ion Beam CharacteristicsAuthor: Nathalie Cagnat.Cyrille Laviron.Nicolas Auriac.Jinning Liu.Sandeep.Mehta.Laurent Frioulaud & Daniel MathiotImplanter Types: VIISta 80 | |
 |
| VSEA7008 | 11/30/2006 | Characterization of B2H6 Plasma Doping for Converted p+ Poly-Si GateAuthor: Jae-Geun Oh.J.K. Lee.S.H. Hwang.H.J. Cho.Ys Sohn.D.S. Sheen.Sh Pyi.S.W. Lee.S.H. Hahn.Y.B. Jeon.Z. Fang And V. SinghImplanter Types: P2Lad | |
 |
| VSEA7007 | 11/30/2006 | Backing up Medium Current Implanters using Single Wafer High Energy Implanter for Manufacturing EfficiencyAuthor: H.L. Sun.Woojin Lee.And Knight Xu.Hy Tsun.Kt Peng.Ls Juang.And Hp TsengImplanter Types: VIISta 3000, VIISta 810 | |
 |
| VSEA7006 | 11/30/2006 | B2H6 PLAD Doped PMOS Device PerformanceAuthor: Z. Fang.T. Miller.E. Winder.H. Persing.E. Arevalo.A. Gupta.T. Parrill.And V. SinghImplanter Types: P2Lad | |
 |
| VSEA7005 | 11/30/2006 | Advanced Single Wafer High Current Beamline Architecture for Sub-65nmAuthor: G. Redinbo.C. Campbell.J. MullinImplanter Types: VIISta 80 | |
 |
| VSEA7004 | 11/30/2006 | Advantages of Dual Magnet Ribbon Beam Architecture for Particle Control in Single Wafer High Current ImplantAuthor: C. Campbell.G. Redinbo.J. Blake.P. Kellerman.E. Moore And N. VariamImplanter Types: VIISta 80 | |
 |
| VSEA7003 | 11/30/2006 | APC Implementation on VIISta Ion ImplantersAuthor: Youn Ki Kim.Bret Adams.Nick Parisi.Sandeep Mehta.Jim HamiltonImplanter Types: All VIISta Models | |
 |
| VSEA7002 | 11/30/2006 | Advanced Charge Control for Single Wafer ImplantersAuthor: P. F. Kurunczi.A. S. Perel.E. Wright.S. Kikuchi.And J. T. ScheuerImplanter Types: All Models | |
 |
| VSEA7001 | 11/30/2006 | Advanced Modeling Techniques for Analysis of High Current Ribbon Beam Transport and ControlAuthor: P. Kellerman And F. SinclairImplanter Types: VIISta 80 | |
 |
| VSEA70 | 01/11/2005 | Modeling of Motion Control Systems Used in an Ion ImplanterAuthor: W.S. Chang.Dennis Rodier.Paul Murphy.Sean LuImplanter Types: All Models | |
 |
| VSEA7 | 11/01/2002 | Requirements and Challenges in Ion Implanters for Sub-100nm CMOS Device FabricationAuthor: Ukyo Jeong.Baonian Guo.Gongchuan Li.Sandeep Mehta.Z. ZhaoImplanter Types: | |
 |
| VSEA6 | 12/15/2002 | Formation of Ultrashallow Junctions in 500EV Boron Implanted Silicon Using NonMelt Laser AnnealingAuthor: Dan Downey.Edwin Arevalo.S. Earles.J. Frazer.M. Law.K. Jones.S. TalwarImplanter Types: | |
 |
| VSEA5 | 01/14/2002 | Advanced Annealing for Sub-130nm Junction FormationAuthor: Dan Downey.Edwin Arevalo.J. Gelpey.K. Elliott.D. Camm.S. Mccoy.J. RossImplanter Types: | |
 |
| VSEA4 | 11/04/2002 | Channeling Doping Profiles Studies for Small Incident Angle Implantation into Silicon WafersAuthor: Baonian Guo.Naushad Variam.Ukyo Jeong.Sandeep Mehta.M .Posselt.A. LebedevImplanter Types: | |